Tannlin Multilevel Laser Cut Stencils
Building on our range of high performance stencils for the electronics assembly industry comes the new Tannlin Multilevel stencil.
Manufactured using the Tannlin proprietary laser process allows greater flexibility and control in the print process over standard SMT stencils.
Why use Tannlin Multilevel technology?
- To facilitate an increase or decrease of paste volume and deposit height on selected PCB areas where you have mixed component technology, large ground pads, intrusive reflow or coplanarity issues.
- To improve the stencil to board gasket and print repeatability where you have topography issues on PCBs e.g. labels, solder mask inconsistencies and tented vias.
- To allow simultaneous printing of 3D cavities on a PCB.
|Step areas||20 - 150 microns with support for complex shapes|
|Step Ramp||controlled step ramp in 50 micron increments, optional matched squeegee blades|
|Positional accuracy||< 10 microns on the step areas|
|Material thickness||+/- 2% (primary steel and step steel)|
|Board side distortion||flat with no impact|
|Environmentally friendly||no hazardous chemicals or pollutants in process|
|Process||to be available at all Tannlin manufacturing facilities|
|Lead-time||half day quick turn service available|