Laser Cut Stencils

A unique understanding of stencil production and surface mount assembly processes gives Tannlin an in-depth appreciation of the need for accuracy to support process control, consistency and stability. Tannlin-manufactured stencils will contribute positively to yield and quality through unparalleled cut-edge quality and geometry, ensuring optimal paste release.

Tannlin laser cut stencils provide:


  • Aperture sizes accurate to 1 micron, for apertures as small as 20 microns
  • Material thickness from 20 microns up to 500 microns
  • Superior surface flatness compared with full electroformed stencils
  • Optimised surface finish for enhanced paste roll
  • Extended stencil life on nickel plated stencils for high volume production
  • Consistent paste release for area ratios as low as 0.5 with no additional surface treatments.
  • Nanocoat stencil treatment

All Tannlin stencils are manufactured using Tannlin proprietary auto-tooling software. Laser cut stencils can be supplied in all industry foil formats. Tannlin recommends Vectorguard; designed specifically to meet the needs of both surface mount assemblers and stencil manufacturers.

As one of the largest manufacturers of laser cut stencils, Tannlin operates a fully closed loop supply process from ordering through design, manufacture, supply and performance monitoring of stencil products to ensure continuous improvement in design and quality for every customer. The Tannlin approach to process ensures bespoke and flexible stencil solutions for new and emerging technologies to meet the evolving needs of the surface mount industry.



  • All modifications automatically tooled to customer specifications.
  • All apertures fine tuned to maximize paste transfer efficiency.
  • Material thickness from 20 microns.
  • Stencil apertures down to 20 microns.
  • Proven consistent paste release on area ratio as low as 0.55 without any additional surface treatment.
  • Best in class for aperture size accuracy.
  • Best in class for positional accuracy.

  • Customized thickness to maximize your print process & paste transfer efficiency.
  • Superior surface flatness compared to full electroformed stencils.
  • Extended stencil life. Perfect for high volume products.
  • Optimised surface finish for enhanced paste roll.
  • Laser cut plated apertures to improve paste release.

  • Step up areas designed to increase paste volume in selected areas.
  • Ideal for pin-in-paste process to maximize hole fill and fillet solder joint on underside.
  • Proven solution for component co-planarity issues.
  • Proven solution for head-in-pillow defect.
  • Customized thickness for step-down areas to reduce paste volume in selected areas.
  • Smooth transition between different thickness material to prevent damage to squeegee blade & improve print.
  • Underside recess for PCB labels or raised areas to ensure perfect gasketing between stencil & PCB.
  • Optimised surface finish prevents paste from drying-up whilst in use on stencil surface.
  • Easy to clean

  • Removes the requirement for glue dispensing equipment.
  • Deposit glue for all SMT parts with one squeegee stroke.
  • Controlled glue deposit - size, shape, height and volume.
  • Glue apertures designed to customer requirements or from Tannlin footprint library.

  • Re-balling kits for reworking BGA components.
  • Re-balling kits for reworking QFN components.
  • Mini-Stencils for reworking specific footprint on your PCB.
  • Custom designed to suit your process.

  • Custom formats to suit specific applications.
  • Frame sizes examples 950 x 950mm, 760 x 1500mm.
  • Cut area up to 603 x 1200mm.
  • Material thickness from 20 microns.
  • Stencil apertures down to 20 microns.
  • Proven consistent paste release on area ratio as low as 0.55 without any additional surface treatment.
  • Best in class for aperture size accuracy.
  • Best in class for positional accuracy.